Grain Boundary Diffusion in Copper under Tensile Stress
| dc.creator | Crosby, Kevin M. | |
| dc.date | 2003-07-02 | |
| dc.date.accessioned | 2026-07-25T22:42:19Z | |
| dc.description | Stress enhanced self-diffusion of Copper on the $Σ$3 twin grain boundary was examined with molecular dynamics simulations. The presence of uniaxial tensile stress results in a significant reduction in activation energy for grain-boundary self-diffusion of magnitude 5 eV per unit strain. Using a theoretical model of point defect formation and diffusion, the functional dependence of the effective activation energy $Q$ on uniaxial tensile strain $ε$ is shown to be described by $Q(ε)=Q_0-E_0V^*ε$ where $E_0$ is the zero-temperature Young's modulus and $V^*$ is an effective activation volume. The simulation data agree well with this model and comparison between data and model suggests that $V^*=0.6Ω$ where $Ω$ is the atomic volume. $V^*/Ω=0.6$ is consistent with a vacancy-dominated diffusion mechanism. | |
| dc.description | 5 pages 3 figures. submitted to JMR | |
| dc.identifier | https://arxiv.org/abs/cond-mat/0307065 | |
| dc.identifier | http://arxiv.org/abs/cond-mat/0307065 | |
| dc.identifier.uri | https://dspace.dare.co.zw/handle/123456789/91682 | |
| dc.subject | Materials Science | |
| dc.title | Grain Boundary Diffusion in Copper under Tensile Stress | |
| dc.type | text |