Application of Raman Scattering to Study the Strain Distribution in SiGe Layers

dc.creatorPan, Zhongwei
dc.creatorChin, Richard
dc.date1999-05-12
dc.date1999-06-17
dc.date.accessioned2026-07-25T16:20:28Z
dc.descriptionIn this paper, we mainly present a new simple, efficient and nondestructive Raman scattering analysis method to study the distribution of strain in SiGe alloy films. The method can simultaneously determine both Ge fractional composition x and strain of SiGe films. We use the Ar+ laser lines (514.5, 488 and 457.9 nm) to detect the information of different depth of SiGe layers. The results show that the x value (about 0.50) of Si1-xGex and the strain of the films decrease from the interface between SiGe layers and Si substrates to SiGe surface.
dc.description3 pages, 4 figures, 1 table
dc.identifierhttps://arxiv.org/abs/cond-mat/9905175
dc.identifierhttp://arxiv.org/abs/cond-mat/9905175
dc.identifier.urihttps://dspace.dare.co.zw/handle/123456789/40502
dc.subjectMaterials Science
dc.titleApplication of Raman Scattering to Study the Strain Distribution in SiGe Layers
dc.typetext

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